| 发明名称 |
CIRCUIT BOARD MANUFACTURING METHOD, SEMICONDUCTOR MANUFACTURING APPARATUS, CIRCUIT BOARD AND SEMICONDUCTOR DEVICE |
| 摘要 |
<p>There is provided a circuit board manufacturing method that makes it possible to manufacture a next-generation semiconductor device in a stable manner and improve the yield during secondary mounting processing. A circuit board 11 with a thickness of 230 mum manufactured using a cyanate-based prepreg 12 containing a resin composition with which a glass cloth is impregnated is heated at a higher temperature than a glass transition temperature of the resin composition after it is cured before reflow processing.</p> |
| 申请公布号 |
KR101409048(B1) |
申请公布日期 |
2014.06.18 |
| 申请号 |
KR20097016928 |
申请日期 |
2008.02.08 |
| 申请人 |
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发明人 |
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| 分类号 |
H01L23/12;H01L23/14;H05K3/34 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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