| 摘要 |
PURPOSE: An electronic component mounting tool is provided to improve production efficiency by maintaining a suitable state of mounting electronic components. CONSTITUTION: A tool body (12) adsorbs a semiconductor chip (30). The tool body adsorbs a gas part (11). A spacer (20) is inserted between the surface of the gas part and the semiconductor chip. The appearance of the tool body is smaller than the appearance of the semiconductor chip. The appearance of the spacer is larger than the appearance of the semiconductor chip. |
