LED CHIP HAVING HORIZONTAL STRUCTURE

摘要

An LED chip having a horizontal structure; a transparent SiO2 insulation layer (3) is coated on a positively-installed or inversely-installed LED chip, a GaN layer, an n-GaN layer (5) and a p-GaN layer (2); and an electrode is plated on the n-GaN layer and the p-GaN layer respectively; the substrate of the positively-installed or inversely-installed LED chip is a transparent substrate, sapphire or silicon carbide; and the material of the transparent SiO2 insulation layer is silica gel, resin or nonconductive organic film. The horizontal structure ensures that an LED chip, like a conventional chip resistor and capacitor, can be directly attached to a substrate or a support with a die bonder or a chip mounter during packaging and manufacturing, is suitable for various LED chip packaging modes, and increases package substrate materials for the LED chip, thus improving LED chip package efficiency and package capacity.