CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD

摘要

This circuit board is provided with: an insulating board (14) having a first surface (10) and a second surface (12) on a side opposite to the first surface (10); surface metal layers (20a, 20b) provided on the first surface (10) and the second surface (12); through holes (16) passing through from the first surface (10) to the second surface (12); a hole lining metal layer (28) that covers the inner wall surfaces of the through holes (16) and connects the surface metal layer (20a) provided on the first surface (10) with the surface metal layer (20b) provided on the second surface (12). The hole lining metal layer (28) is provided so as to be thicker than the thickness of the surface metal layers (20a, 20b).