| 摘要 |
<p>An apparatus for recutting the surface of a wheel is described. The apparatus comprises a rotatable mount, for holding and rotating the wheel about i ts axis, a surface profiler, operable during rotation of the wheel to detect surface elevations at different radial positions on the wheel, a surface elevation profile generator, operable to generate a surface elevation profile of at least a portion of the surface of the wheel from the detected surface elevations, a cutting profile generator, operable to calculate a cutting profile for the wheel from the surface elevation profile, the cutting profile defining a cutting elevation with respect to radial position, a cutting tool, and cutting control circuitry, operable to control the position of the cutting tool with respect to the wheel to recut the surface of the wheel in accordance with the generated cutting profile. By profiling the wheel while it is rotating, the time required to profile a desired portion of the wheel can be reduced.</p> |
