| 摘要 |
PROBLEM TO BE SOLVED: To increase the bandwidth of a probing tip for a signal acquisition probe.SOLUTION: A curved probing tip contact 24 having first and second arcuate surfaces 26 and 28 intersecting at a surface is formed at a converging point of a non-conductive substrate 12 of a probing tip 10. Electrically conductive material is laminated on the contact 24 using the thin or thick film process for providing electrical contact to test points on a device under test. A resistive element 30 is formed on the non-conductive substrate 12 using the thin film process. The resistive element 30 is electrically coupled to the contact 24 and to an input of an amplifier formed on an integrated circuit die 36 mounted on the non-conductive substrate 12. An output terminal of the amplifier is coupled to a transmission structure 70 formed on a second non-conductive substrate 58. |
