PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

摘要

Disclosed are a printed circuit board capable of increasing heat dissipation and bending strength by using aluminum and a manufacturing method therefor. The printed circuit board comprises: a double-sided substrate which comprises an insulation layer of an insulating material, a base layer which is bonded on either side of the insulation layer and has a circuit pattern formed on the surface thereof and is made of an aluminum material, and a bonding member interposed to bond the base layer to the insulation layer; a second insulation layer formed on the base layer of the double-sided substrate; a second base layer which is bonded on the second insulation layer by means of a second bonding member; a via hole which penetrates the double-sided substrate, the second insulation layer, and the second base layer; a substitution layer formed by the surface treatment of zincifying the surface of the second base layer and the exposed inner part of the via hole; a plating layer formed on the substitution layer; and a second circuit pattern formed on the plating layer.