Glue supplying apparatus and glue supplying method

摘要

Glue supplying apparatus and glue supplying method that suppress decomposition and corrosion of glue is provided to utilize the effect of the glue. A glue supplying apparatus 2 that supplies a glue solution 200 into an electrolytic solution 10 in an electrolytic vessel 11 for performing electrolytic refining of copper has a dissolution bath 23 for dissolving the glue 20, a feeder unit 22 that supplies the glue into the dissolution bath 23, a solution-level measuring device 27 that measures the height level of the glue solution 200 stored in the dissolution bath 23, and a control unit 30 that measures the height level of the glue solution 200 in the dissolution bath 23 by the solution-level measuring device, and controls a feeder mechanism 223 of the feeder unit 22 and a valve 250 to replenish the glue and water in respective amounts thereof required for replenishing the glue solution 200. The glue supplying apparatus 2 generates a small amount of the glue solution every time while continuously supplying the same into the electrolytic solution 10. 21 20 30 17c p 16c 16a CONTROL 130 26 -103 p 3 22, ,,^"103220 251 250 ELECTRLTC 28 ',DRAIN VAPOR 25 VESSEL DISSOLUTION BATH 200 33 34: HYDROCHLORIC ACID 18 ------ ----- ADDITIVE VESSEL 14 17b 16b -1------------------------