POWER SEMICONDUCTOR CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

A power semiconductor circuit device and a method for manufacturing the same, both of which are provided with: a base board (12) on which at least a power semiconductor element (10) is mounted; a resin (15) which molds the base board and the power semiconductor element in a state where partial surfaces of the base board, including a base board surface opposite to a surface on which the power semiconductor element is mounted, are exposed; and a heat dissipating fin (16) joined to the base board by a pressing force. A groove (14) is formed in the base board (12) at a portion to be joined to the heat dissipating fin, and the heat dissipating fin (16) is joined by caulking to the groove (14).