发明名称 |
Bond wire arrangement for efficient signal transmission |
摘要 |
<p>In one embodiment, a device includes a first IC having a differential signal driver and a first isolation circuit configured to provide differential signals transmitted by the differential signal driver to a first pair of bond pads of the first IC. First and second bond wires are configured to provide differential signals from the first pair of bond pads to a second pair of bond pad included in a second IC. The second IC includes a second isolation circuit configured to provide differential signals from the second pair of bond pads to a differential receiver circuit of the second IC. The bond wires are specifically arranged such that a distance between the first and second bond wires varies by at least 10% as measured at two points along a length of the first bond wire.</p> |
申请公布号 |
EP2741325(A1) |
申请公布日期 |
2014.06.11 |
申请号 |
EP20130192667 |
申请日期 |
2013.11.13 |
申请人 |
NXP B.V. |
发明人 |
STEENEKEN, PETER;SHRESTHA, RAMESWOR;BREDIUS, MARTIJN |
分类号 |
H01L23/49;H01L23/66;H04L25/02 |
主分类号 |
H01L23/49 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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