MEMS structure with adaptable inter-substrate bond

摘要

A MEMS structure incorporating multiple joined substrates and a method for forming the MEMS structure are disclosed. An exemplary MEMS structure includes a first substrate having a bottom surface and a second substrate having a top surface substantially parallel to the bottom surface of the first substrate. The bottom surface of the first substrate is connected to the top surface of the second substrate by an anchor, such that the anchor does not extend through either the bottom surface of the first substrate or the top surface of the second substrate. The MEMS structure may include a bonding layer in contact with the bottom surface of the first substrate, and shaped to at least partially envelop the anchor.

主权项

1. A method for forming a MEMS device comprising:
receiving a first substrate; receiving a second substrate having one or more dielectric layers; etching at least one of the one or more dielectric layers to define a recess; forming a bonding layer on the one or more dielectric layers, wherein the forming of the bonding layer includes forming an anchor defined by the recess; joining the first substrate to the bonding layer; and removing at least one of the one or more dielectric layers to release a portion of the first substrate.