| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an integrated circuit having a lamination structure.SOLUTION: An integrated circuit includes: a first integrated circuit in which a power supply voltage is applied to a power supply input end; and a second integrated circuit in which a power supply input end is connected to a ground end of the first integrated circuit, a voltage is applied to a central node formed by the connection, and a ground end is connected to a ground power supply, and has a lamination structure in which the power supply voltage is divided into first and second voltages and supplied to the first and second integrated circuits. The integrated circuit having the lamination structure is advantageous for connecting the integrated circuits in the lamination structure, reducing the number of pads and operating at a high power supply voltage. Also, this invention can reduce manufacturing cost by reducing the number of pads and reduce power consumption by operating the integrated circuits at a low power supply voltage despite application of the high power supply voltage.</p> |
