| 摘要 |
Disclosed is a plating rack device that is used in a substrate plating operation. The plating rack device includes a first rack frame that has a first bonding surface which corresponds to a surface of a circumferential portion of a substrate; a second rack frame that has a second bonding surface which is to be bonded to the first bonding surface of the first rack frame; a bonding fixing portion that has a fixing tool which is formed to connect the first bonding surface and the second bonding surface to be engaged and held in a bonding state when the first rack frame and the second rack frame move in a bonding direction; and a substrate fixing portion that has a pressing tool which is formed to be capable of pressing and holding the circumferential portion of the substrate between the first bonding surface and the second bonding surface when the first rack frame and the second rack frame are in the bonding state due to the bonding fixing portion. |
