| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a solder inspection method capable of efficiently inspecting solder by correcting the position of a substrate in a short time.SOLUTION: The solder inspection method uses a solder inspection apparatus including: a camera (imaging means) 5 for imaging a soldered portion of an electronic component soldered on a substrate 7; an illumination device (illumination means) 6 for illuminating the soldered portion of the electronic component; an image processing device (image processing means) 2 for determining the quality of soldering through processing on the image obtained by the camera 5; and a monitor (display means) 3 for displaying the result of the determination by the image processing device 2. In the solder inspection method, plural geometric feature points are extracted from the image subjected to the image processing by the image processing device 2, and the feature points are used as reference points for correcting the position of the substrate 7.</p> |
