发明名称 |
LOW PROFILE MEMORY MODULE |
摘要 |
An electronic component module according to an embodiment of the present invention includes a printed circuit board including a low-profile plug and at least one memory component thereon, and a connector for connecting the printed circuit board to a motherboard, the connector being mateable with the plug on the printed circuit board and having a z-height of no more than about 1.5 mm. The low-profile plug includes one hundred seventy pins and the number of pins allocated for VSS is no more than twenty-two and the number of pins allocated for VDD is no more than sixteen. Further, the low-profile plug includes an insulative portion protruding from a surface of the printed circuit board and having a “”-like or inverted “”-like profile in its center. The connector includes two sub-connectors, and an insulative portion having a “”-like or inverted “m”-like profile in the center. |
申请公布号 |
US2014153201(A1) |
申请公布日期 |
2014.06.05 |
申请号 |
US201314094605 |
申请日期 |
2013.12.02 |
申请人 |
CHENG MARK KUANYU;BURLINGTON MARK;NGUYEN HENRY HAI DANG |
发明人 |
CHENG MARK KUANYU;BURLINGTON MARK;NGUYEN HENRY HAI DANG |
分类号 |
H05K1/18 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
1. A module comprising:
a printed circuit board including a plug and at least one memory component thereon; and a connector for connecting the printed circuit board to a motherboard, the connector being mateable with the plug on the printed circuit board and having a z-height of no more than about 1.5 mm.
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地址 |
Fountain Valley CA US |