| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device.SOLUTION: In a semiconductor device 1, a conductor pattern 3PL1 is provided at a position overlapped with a semiconductor chip in a thickness direction, on a mounting surface (a lower surface 3b) of a wiring board 3. On a solder resist film (an insulating layer) 3h covering the lower surface 3b of the wiring board 3, an opening 3k2 is provided so as to expose a plurality of points of the conductor pattern 3PL1. In addition, a conductor opening 3pk1 is provided to the conductor pattern 3PL1. Further, an outline of the opening 3k2 and the conductor opening 3pk1 are overlapped with each other in a plan view. |
