Apparatus for improved power distribution or power dissipation to an electrical component and method for the same

摘要

Embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blinds are located. This permits that via to conduct through the opening. In this way, the capacitance and the resistance will have a closer contact point to the electrical component. A resistance can also be embedded in an opening in the adaptor board and be vertically aligned within the opening to make contact with a pad on top of the adaptor board and a pad at the bottom of the adaptor board so that electricity conducts through the embedded component.

主权项

1. An apparatus for improved power distribution or power dissipation to an electrical component attached to a main circuit board, comprising:
one or more power modification components embedded inside of at least one adaptor board between vias of said adaptor board, said one or more power modification components having terminals in an electrical contact with a pad of said adaptor board, said pad having defined isotropic conductive elastomer thereon so that electricity conducts through said one or more power modification components to place said one or more power modification components close to said electrical component to reduce an electrical length between the one or more power modification components and said electrical component thereby reducing inductance said pad defined isotropic conductive elastomer is with a compression stop; said adaptor board being sandwiched between said electrical component and the main circuit board and said adaptor board being connected or attached to the main circuit board; said one or more embedded components being located so as to extend over and beyond the vias or blind vias of said main circuit board so that a portion of the adaptor board containing the embedded power modification component is located beyond where vias or blind vias of the main circuit board are located to permit that via of the main circuit board to conduct through the opening so that said power modification component is at a closer contact point to said electrical component thereby increasing power distribution or power dissipation, respectively.