Ball grid array with improved single-ended and differential signal performance

摘要

An improved system and method for assigning power and ground pins and single ended or differential signal pairs for a ball grid array semiconductor package. In certain embodiments, the system uses a hexagonal pattern where the grid may be represented by a multiplicity of nested hexagonal patterns.

主权项

1. An integrated circuit package comprising a plurality of pins comprising:
a plurality of pins, the plurality of pins comprising
a first pin, a second pin, a third pin, and a fourth pin, each of the first, second, third, and fourth extending externally to the integrated circuit package, being linearly arranged in a first row and being equally spaced from each other;a fifth pin, a sixth pin, a seventh pin, an eighth pin and a ninth pin extending externally to the integrated circuit package, linearly arranged in a second row separated vertically from the first row and offset horizontally from the first row such that sixth, seventh, eighth and ninth pins are offset from the pins in the first row; wherein said third and seventh pins comprise power/ground pins; and wherein the remaining pins are configured for use as signal pins.