发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING DEVICE, AND RECORDING MEDIUM |
摘要 |
The present invention has a step for forming a film on a substrate by performing a prescribed number of cycles comprising: a step for feeding a raw material gas to a substrate inside a processing chamber; a step for exhausting raw material gas remaining inside the processing chamber; a step for feeding a reaction gas to the substrate inside the processing chamber; and a step for exhausting reaction gas remaining inside the processing chamber. In the step for feeding the raw material gas, the raw material gas is fed into the processing chamber in a state in which the exhausting inside the processing chamber has essentially stopped, and then, in a state in which exhausting inside the processing chamber and feeding of raw material gas have essentially stopped, an inert gas is fed inside the processing chamber. |
申请公布号 |
WO2014080785(A1) |
申请公布日期 |
2014.05.30 |
申请号 |
WO2013JP80417 |
申请日期 |
2013.11.11 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC. |
发明人 |
HANASHIMA TAKEO;WANG JIE;NODA TAKAAKI |
分类号 |
H01L21/316;C23C16/455;H01L21/31 |
主分类号 |
H01L21/316 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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