发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING DEVICE, AND RECORDING MEDIUM
摘要 The present invention has a step for forming a film on a substrate by performing a prescribed number of cycles comprising: a step for feeding a raw material gas to a substrate inside a processing chamber; a step for exhausting raw material gas remaining inside the processing chamber; a step for feeding a reaction gas to the substrate inside the processing chamber; and a step for exhausting reaction gas remaining inside the processing chamber. In the step for feeding the raw material gas, the raw material gas is fed into the processing chamber in a state in which the exhausting inside the processing chamber has essentially stopped, and then, in a state in which exhausting inside the processing chamber and feeding of raw material gas have essentially stopped, an inert gas is fed inside the processing chamber.
申请公布号 WO2014080785(A1) 申请公布日期 2014.05.30
申请号 WO2013JP80417 申请日期 2013.11.11
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 HANASHIMA TAKEO;WANG JIE;NODA TAKAAKI
分类号 H01L21/316;C23C16/455;H01L21/31 主分类号 H01L21/316
代理机构 代理人
主权项
地址