| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a conductive film having high conductivity and excellent adhesion to a substrate, a precursor film allowing formation of the conductive film, and a method of producing the conductive film.SOLUTION: A precursor film 10 for a conductive film formed on a substrate 16 and containing metallic copper contains copper oxide particles 11 and a hardenable compound 12. The content ratio of copper oxide particles present in the upper layer region 13 from the surface to the depth of a third of the whole thickness is higher than the content ratio of copper oxide particles present in a lower layer region 15 deeper than the depth of two thirds of the whole thickness from the surface, and the content ratio of the hardenable compound present in the upper layer region 13 from the surface to the depth of a third of the whole thickness is lower than the content ratio of the hardenable compound present in the lower layer region 15 deeper than the depth of two thirds of the whole thickness from the surface.</p> |
