HEAT DISSIPATION SYSTEM FOR POWER MODULE

摘要

The present invention relates to a heat dissipation system for a power module which may include a first heat dissipation member which includes a groove for a heat dissipation member formed with a preset depth on one surface; a second heat dissipation member inserted into the groove for a heat dissipation member and includes a first cooling medium flow path and a cooling medium injection nozzle which injects a cooling medium transferred from the cooling medium flow path to a heat dissipation plate; and the heat dissipation plate formed on the first heat dissipation member and separated from the cooling medium injection nozzle of the second heat dissipation member.