发明名称 THERMAL TREATMENT DEVICE AND THERMAL TREATMENT METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a thermal treatment device and a thermal treatment method which inhibit temperature distribution during cooling.SOLUTION: A thermal treatment device of the invention comprises: a cooling chamber 120 which cools a heated processed object M; a mist supply part 20 which supplies coolant mist to the cooling chamber 120; a gas supply part 30 which supplies a gas to the cooling chamber 120 to adjust a flow direction of the coolant mist; an on-off valve 38 which changes a supply direction of the gas stored in the gas supply part 30; a temperature measurement part 40 which measures a temperature of the processed object M; and a control part 50 which controls the on-off valve 38 on the basis of a measurement result of the temperature measurement part 40. The temperature measurement part 40 measures the temperature of the processed object M at multiple positions. The control part 50 controls the on-off valve 38 on the basis of a measured temperature difference in the processed object M.</p>
申请公布号 JP2014095548(A) 申请公布日期 2014.05.22
申请号 JP20140009772 申请日期 2014.01.22
申请人 IHI CORP 发明人 KATSUMATA KAZUHIKO
分类号 F27D9/00;C21D1/18;C21D1/667;C21D1/74;C21D1/773 主分类号 F27D9/00
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