THIN FILM TYPE CHIP DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a thin film type chip device and a method for manufacturing the same. The thin film type chip device according to one embodiment of the present invention includes a substrate; unit circuit structures stacked on the substrate; and a bonding layer which bonds the unit circuit structures. According to one embodiment of the present invention, the unit circuit structure includes a lower pattern; a lower polymer insulating layer which covers the lower pattern; an upper pattern which is arranged on the lower pattern; and an upper polymer insulating layer.