CMP PAD WITH WELL-DIPSERSED PORE STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

摘要

Provided in the present invention is a manufacturing method for a CMP pad, which comprises as follows: a step of mixing urethane prepolymer with a hardener into a reactor; a step of stirring the urethane prepolymer and the hardener inside the reactor for a fixed period of time at an atmospheric pressure condition; and a step of hardening the mixture. In addition, the manufacturing method for a CMP pad is characterized by forming a pore with a diameter of 20-200 micrometers and a porosity of 10-30% in the mixture. Therefore, the chemical and mechanical grinding pad can regulate pore formation by stirring in the reactor inside a polymer matrix, can maximize the grinding efficiency and the flatness of a wafer through consistent pores on a high hardness pad, and can solve the problems of the current highly-integrated and subdivided process such as a defect, dishing, and a low grinding speed through stable pore formation.