发明名称 MANUFACTURING METHOD OF LED MOUNTING PRODUCT, RESIN MOLD METHOD OF LED MOUNTING PRODUCT, AND LED MANUFACTURING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an LED mounting product which achieves high manufacturing yield and high reliability.SOLUTION: An LED mounting product 10 includes: a wiring board 11 having a wiring layer 15 and a surface protective layer 16 which covers the wiring layer 15 to protect the wiring layer 15; an LED chip 12 which is mounted on the wiring board 11 and is electrically connected with the wiring layer 15 exposed from the surface protective layer 16; a reflector part 23 molded at an area on the wiring board 11, which is located around the LED chip 12, by using a resin for a reflector; and a lens part 24 which is molded on the wiring board 11 by using a resin for a lens so as to cover the LED chip 12 and the reflector part 23.
申请公布号 JP2014093464(A) 申请公布日期 2014.05.19
申请号 JP20120244129 申请日期 2012.11.06
申请人 APIC YAMADA CORP 发明人 SAITO TAKASHI
分类号 H01L33/58 主分类号 H01L33/58
代理机构 代理人
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