| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering method capable of densifying a film formed by a simple method, when a film is formed by applying AC power (high-frequency power) to a target of an insulator.SOLUTION: A substrate W is installed on a metal stage 5 provided in a vacuum treatment chamber 1a, and sputter gas is introduced into the vacuum treatment chamber subjected to vacuum drawing, and AC power is inputted into a target 2 provided in the vacuum treatment chamber to sputter the target, and to thereby form a film on the substrate surface. During sputtering, the electric potential of the stage 5 is set in the floating state. |
