摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer ceramic capacitor eliminating failures due to variance of the thickness of the multilayer ceramic capacitor and overcoming problems with filling of a resin, by minimizing variance of the thickness of multilayer ceramic or an external electrode of the multilayer ceramic capacitor, and a printed circuit board including the multilayer ceramic capacitor.SOLUTION: In the multilayer ceramic capacitor including multilayer ceramic and external electrodes formed on both sides of the multilayer ceramic, |Tmax-Tmin| is 10μm or less, and |CTmax-CTmin| is 20μm or less, where Tmax is a maximum thickness of the external electrodes in a via processing area, Tmin is a minimum thickness of the external electrodes in the via processing area, CTmax is a maximum thickness of the multilayer ceramic capacitor in the via processing area, and CTmin is a minimum thickness of the multilayer ceramic capacitor in the via processing area.</p> |