发明名称 MULTILAYER CERAMIC CAPACITOR AND PRINTED CIRCUIT BOARD INCLUDING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a multilayer ceramic capacitor eliminating failures due to variance of the thickness of the multilayer ceramic capacitor and overcoming problems with filling of a resin, by minimizing variance of the thickness of multilayer ceramic or an external electrode of the multilayer ceramic capacitor, and a printed circuit board including the multilayer ceramic capacitor.SOLUTION: In the multilayer ceramic capacitor including multilayer ceramic and external electrodes formed on both sides of the multilayer ceramic, |Tmax-Tmin| is 10μm or less, and |CTmax-CTmin| is 20μm or less, where Tmax is a maximum thickness of the external electrodes in a via processing area, Tmin is a minimum thickness of the external electrodes in the via processing area, CTmax is a maximum thickness of the multilayer ceramic capacitor in the via processing area, and CTmin is a minimum thickness of the multilayer ceramic capacitor in the via processing area.</p>
申请公布号 JP2014093524(A) 申请公布日期 2014.05.19
申请号 JP20130224055 申请日期 2013.10.29
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 YI SUN-UN;YI BYON-HWA;SIN I NA;CHUNG YUL KYO
分类号 H01G4/232;H01G2/06;H01G4/252;H01G4/30;H05K3/46 主分类号 H01G4/232
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