SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To inhibit the occurrence of a failure to make it impossible to perform electrolytic plating on a region inside a chip and surrounded by a groove.SOLUTION: A semiconductor device comprises: a surface protection film 15 formed on a semiconductor substrate 11 on which an element region 12 is formed; and a groove 16 which surrounds the element region 12 and an opening which exposes input/output terminals 13 of the element region 15, which are formed on the surface protection film 15. The groove 16 includes a region 16-1 formed with a first width and a region 16-2 formed with a second width wider than the first width. With this configuration, the occurrence of a failure to make it impossible to perform electrolytic plating on a region inside a chip surrounded by the groove can be inhibited.