METHOD AND APPARATUS FOR SEGMENTING BRITTLE MATERIAL SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method and an apparatus for segmenting a substrate which allow reducing the push-in depth of an upper blade in breaking.SOLUTION: The operation procedures of a method and an apparatus for segmenting a substrate comprise: adhering a brittle material substrate W to the lower surface of an elastic adhesive film 2 supported by a dicing ring 1; forming a plurality of scribe lines S in the lower surface of the substrate W; bringing a pair of receiving blades 4 and 4 into contact with the parts of the lower surface of the substrate W at right and left positions bridging over the scribe line S to be segmented; arranging an upper blade 6 at portions opposed to the scribe lines S in the surface opposite to the surface on which the scribe lines S of the substrate W are formed; and breaking the substrate W along the scribe lines S by pressing the upper blade 6 to the substrate W from over the adhesive film 2 to produce a three-point bending moment. In breaking with the upper blade 6, the substrate W is arranged at positions where the receiving blades 4 and 4 push up the adhesive film 2 so as to produce a downward tensile force in the adhesive film 2 supporting the substrate W and broken.