| 摘要 |
PROBLEM TO BE SOLVED: To provide a member for a semiconductor manufacturing device in which a gas dispersion plate or a shaft is not corroded, cracking is unlikely to occur and arcing is unlikely to occur.SOLUTION: In a high frequency power supply device 10, a shaft 16 including a through hole 20 through which gas passes is joined to one side of a plate 12 which is a gas dispersion plate with a high frequency electrode 14 buried therein. Both the plate 12 and the shaft 16 are made of ceramics. The shaft 16 has a double tube structure including an inner tube 18 and an outer tube 22, and an internal space of the inner tube 18 becomes the through hole 20. The plate 12, the inner tube 18 and the outer tube 22 are joined in a solid-phase state so as to maintain air-tightness, respectively. A position to join the shaft 16 is the center of the plate 12. |
