用于半导体元件之制造中直接铜电镀及填补以形成内连线之方法与组合物,申请号TW096106492-传众专利搜索

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发明名称	用于半导体元件之制造中直接铜电镀及填补以形成内连线之方法与组合物
摘要
申请公布号	TWI437638	申请公布日期	2014.05.11
申请号	TW096106492	申请日期	2007.02.26
申请人	阿奇默公司法国	发明人	荷西　康萨里兹;贺维　蒙巧克斯
分类号	H01L21/3205;H01L21/768;C25D3/38	主分类号	H01L21/3205
代理机构		代理人	陈长文台北市松山区敦化北路201号7楼
主权项
地址	法国

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