| 摘要 |
A semiconductor package includes a mounting substrate having a chip-mounting region and a peripheral region, a first semiconductor chip mounted on the chip-mounting region of the mounting substrate, a first molding member on the mounting substrate to cover at least a portion of the first semiconductor chip, a plurality of first conductive connection members penetrating at least a portion of the first molding member, the first conductive connection members electrically connected to a plurality of ground connection pads provided on the peripheral region of the mounting substrate, respectively, and an electromagnetic interference (EMI) shield member covering the first semiconductor chip and including a graphite layer electrically connected to the first conductive connection members. |
