发明名称 |
IMPROVED CONSTRUCTION KIT FOR MODULE TYPE CIRCUIT ELEMENTS |
摘要 |
<p>According to an improved construction kit for module type circuit elements disclosed in the present invention, individual circuit elements for forming an electronic circuit are formed in the shape of a module, a circuit diagram and the actual elements of the circuit elements can be intuitionally identified through an upper surface and a lower surface of a circuit element block module having the shape of module, user convenience is improved by coupling the circuit element block module with a lead line connection block module without using a soldering process or a wire connection process, a connection error and a malfunction of a port occurring in existing SMD or dip type circuit elements are prevented, and the learning of the electronic circuit elements can be improved by enhancing an intuitive learning approach of a learner.</p> |
申请公布号 |
WO2014069775(A1) |
申请公布日期 |
2014.05.08 |
申请号 |
WO2013KR07603 |
申请日期 |
2013.08.23 |
申请人 |
KANG, MIN SOO;PARK, MI HEE |
发明人 |
KANG, MIN SOO;PARK, MI HEE |
分类号 |
G09B23/18;G09B25/02;H05K3/32 |
主分类号 |
G09B23/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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