| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module having a modular design aspect allowing disassembly.SOLUTION: A power module comprises: a module support; a high-temperature module; and a module cap. The module support includes a frame member, a thermal diffusion body, a first conductive rail, and a second conductive rail. The high-temperature module includes a module substrate, a semiconductor device at least thermally or electrically connected to a surface on the semiconductor side of the module substrate, a first external connector, and a second external connector. The first conductive rail is arranged in a through hole of the first external connector. The second conductive rail is arranged in a through hole of the second external connector. The module cap includes a body part, a plurality of supports, a first opening, and a second opening. The plurality of supports press at least the first external connector, the second external connector, and the module substrate so that the high-temperature module is thermally connected to the thermal diffusion body. |
