| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board having high reliability and a method of manufacturing the same.SOLUTION: The wiring board includes: an interlayer insulating layer 39a; a conductor layer 37c formed on the interlayer insulating layer 39a; a solder resist layer 40a provided on the interlayer insulating layer 39a; an opening 40d penetrating the solder resist layer 40a; an opening 40c formed in the solder resist layer 40a; and a wiring structure 10 which is arranged at a position where the opening 40c is formed, and has an insulating layer 120 and a conductor pattern 111 on the insulating layer 120. The width of the conductor pattern 111 is smaller than that of a conductor pattern formed in the conductor layer 37c. |
