| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board making it possible to mount a surface mount component having a narrow pitch, while increasing a wiring housing amount.SOLUTION: A multilayer wiring board includes: a first metal foil wiring layer having at least two layers, arranged on a side of a mounting face for mounting a surface mount component; a wire wiring layer having an insulation coated wire, arranged on a side opposite to the mounting face; and an inter-layer conduction hole electrically connecting the metal foil wiring on a surface of the first metal foil wiring layer to the metal foil wiring in an inner layer of the first metal foil wiring layer or the insulation coated wire of the wire wiring layer. A hole diameter of the inter-layer conduction hole varies in a plate-thickness direction of the multilayer wiring board. |
