| 摘要 |
The present technique relates to a semiconductor package. More particularly, a semiconductor package according to the present invention includes a first semiconductor package which comprises a first terminal part and a second terminal part which is formed on a surface which is different from the surface of the first terminal part, a second semiconductor package which has a third terminal part connected to the first terminal part. A surface where the first terminal part is formed faces a surface where the third terminal part is formed. |
