| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technology for bonding an electronic component, which quickly controls the temperature of a base material thereby realizing appropriate control a temperature of a thermosetting adhesive. <P>SOLUTION: The electronic component bonding device comprises a first heating unit provided with a heat conductive support member for supporting a metallic plate base material in contact with a second surface of the base material opposite to a first surface thereof, for heating the base material through the support member to bond the base material and an electronic component with a thermosetting adhesive sandwiched between the first surface of the base material and the electronic component, a second heating unit for directly heating the second surface of the base material with radiant heat, and a control unit for controlling a temperature change by using the second heating unit so as to satisfy heating conditions for making a temperature of the adhesive to become a target temperature by heat application of the first heating unit and the second heating unit. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
