发明名称
摘要 PROBLEM TO BE SOLVED: To improve the throughput of a substrate-laminating apparatus. SOLUTION: The substrate-laminating apparatus for pasting substrates, each having an element includes three or more processing portions for executing processing for the substrates, and a transport portion for transporting the substrates with respect to each of the three or more processing portions. Any one of the three or more processing portions is a positioning apparatus for mutually positioning and superimposing the substrates, and the three or more processing portions are each disposed on the circumference with respect to the turning center of the transport portion. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP5487741(B2) 申请公布日期 2014.05.07
申请号 JP20090139658 申请日期 2009.06.10
申请人 发明人
分类号 H01L21/02;H01L21/677 主分类号 H01L21/02
代理机构 代理人
主权项
地址
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