发明名称
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting (meth)acrylic resin composition capable of obtaining a molded article excellent in manufacturing aptitude and a handling property and moldability of SMC and BMC and excellent in appearance, heat-resistance and solvent-resistance, and SMC, BMC and a molded article using it. SOLUTION: The thermosetting (meth)acrylic resin composition for preparing the sheet molding compound or the bulk molding compound includes (meth)acrylic polymer powder (A) having a weight average molecular weight of 50,000-500,000, methyl methacrylate monomer (B), multi-functional (meth)acrylic monomer (C) containing a substance having a boiling point of 150°C or higher, inorganic filler (D), and organic peroxide (E). COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP5486341(B2) 申请公布日期 2014.05.07
申请号 JP20100037945 申请日期 2010.02.23
申请人 发明人
分类号 C08F2/44;C08F265/06;C08J5/04 主分类号 C08F2/44
代理机构 代理人
主权项
地址