发明名称 EPITAXIAL WAFER, METHOD FOR FABRICATING THE WAFER, AND SEMICONDUCTOR DEVICE INCLUDING THE WAFER
摘要 <p>Disclosed is an epitaxial wafer (300B) including a substrate (110), and an epitaxial structure (210B) disposed on the substrate (110), wherein the epitaxial structure (210B) includes a first epitaxial layer (212B), a second epitaxial layer (214B) disposed on the first epitaxial layer (212B), and a third epitaxial layer (216) disposed between the first epitaxial layer (212B) and the second epitaxial layer (214B), the third epitaxial layer (216) having a first doping concentration around a first boundary adjacent to the first epitaxial layer (212B) and a second doping concentration different from the first doping concentration around a second boundary adjacent to the second epitaxial layer (214B).</p>
申请公布号 EP2728610(A1) 申请公布日期 2014.05.07
申请号 EP20130191064 申请日期 2013.10.31
申请人 LG INNOTEK CO., LTD. 发明人 KANG, SEOK MIN
分类号 H01L21/20 主分类号 H01L21/20
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