发明名称 WARM COOLING FOR ELECTRONICS
摘要 A method of providing cooled air to electronic equipment includes capturing heated air from a volume containing electronic equipment, cooling the heated air by more than fifteen degrees Celsius in an air-to-water heat exchanger, and supplying cooling water to the air-to-water heat exchanger at a temperature above a dew point temperature of the heated air.
申请公布号 EP2032907(A4) 申请公布日期 2014.05.07
申请号 EP20060774031 申请日期 2006.06.27
申请人 EXAFLOP LLC 发明人 CARLSON, ANDREW;WHITTED, WILLIAM;CLIDARAS, JIMMY;HAMBURGEN, WILLIAM;AIGNER, GERALD;BEATY, DONALD L.
分类号 F24F3/14 主分类号 F24F3/14
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