发明名称 |
WARM COOLING FOR ELECTRONICS |
摘要 |
A method of providing cooled air to electronic equipment includes capturing heated air from a volume containing electronic equipment, cooling the heated air by more than fifteen degrees Celsius in an air-to-water heat exchanger, and supplying cooling water to the air-to-water heat exchanger at a temperature above a dew point temperature of the heated air. |
申请公布号 |
EP2032907(A4) |
申请公布日期 |
2014.05.07 |
申请号 |
EP20060774031 |
申请日期 |
2006.06.27 |
申请人 |
EXAFLOP LLC |
发明人 |
CARLSON, ANDREW;WHITTED, WILLIAM;CLIDARAS, JIMMY;HAMBURGEN, WILLIAM;AIGNER, GERALD;BEATY, DONALD L. |
分类号 |
F24F3/14 |
主分类号 |
F24F3/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|