发明名称 HOLDING MEMBER MANAGEMENT DEVICE, LAMINATED SEMICONDUCTOR MANUFACTURING DEVICE, AND HOLDING MEMBER MANAGEMENT METHOD
摘要 <p>PROBLEM TO BE SOLVED: To efficiently manage holding members holding semiconductor substrates.SOLUTION: A holding member management device for managing substrate holding members holding semiconductor substrates in a manufacturing device which manufactures a laminated semiconductor device by bonding a plurality of semiconductor substrates comprises: a history storage unit 286 which stores use histories of the substrate holding members in association with the identification information for identifying the substrate holding members; and a holding member specification unit 290 which specifies and outputs identification information of the substrate holding member whose use must be cancelled on the basis of the use histories stored in the history storage unit.</p>
申请公布号 JP2014078726(A) 申请公布日期 2014.05.01
申请号 JP20130239784 申请日期 2013.11.20
申请人 NIKON CORP 发明人 SUGAYA ISAO;SANADA SATORU;MAEDA HIDEHIRO;YOSHIHASHI MASAHIRO;USHIJIMA MIKIO
分类号 H01L21/02;H01L21/683 主分类号 H01L21/02
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