| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting apparatus which can control heating condition by laser-beam irradiation within a specified range, to obtain desired accuracy in cutting.SOLUTION: A cutting apparatus 1 comprises a processing table 2 for floating a work-under-processing W, a laser-beam irradiation section 3 for irradiating the work-under-processing W with a laser-beam L, a coolant spraying section 4 for spraying a coolant C over the work-under-processing W, moving means 5 for moving the work-under-processing W relatively to the laser-beam irradiation section 3 and the coolant spraying section 4. While a heating area 18 is heated by irradiating the work-under-processing W with the laser-beam L from the laser-beam irradiation section 3, the work-under-processing W is moved by the moving means 5, and the coolant C from the coolant spraying section 4 is sprayed to a cooling area 24 set over the heating area 18, to cool the cooling area 24. In the processing table 2, in front of the work-under-processing W in the direction of movement of the work-under-processing W, a scattering section 22 is mounted for scattering the coolant C upon receiving spraying of the coolant C from the coolant spraying section 4. |
