| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat connector and an electronic apparatus, having a connection structure of low thermal resistance.SOLUTION: A heat connector includes: a first heat connector element and a second heat connector element. The first heat connector element made of a first metallic material includes a plurality of first projection parts, and at least a part of the surface of the plurality of first projection parts is covered by a first metal coat containing a first particulate component that is harder than the first metallic material. The second heat connector element made of a second metallic material includes a plurality of second projection parts that slide and contact with the plurality of first projection parts, and at least a part of the surface of the plurality of second projection parts is covered by a second metal coat containing a second particulate component that is harder than the second metallic material. |
