POWER SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

摘要

There are provided a power semiconductor module and a manufacturing method thereof, the power semiconductor module including: a lead frame; a base substrate including a circuit wiring formed on an insulating layer thereof; a plurality of power semiconductor devices disposed to contact the circuit wiring; and a multilayer substrate formed by stacking a plurality of substrates and electrically connecting the power semiconductor devices and the lead frame to one another using a connection line formed therein and having conductivity.