| 摘要 |
The present invention relates to a printed circuit board and a manufacturing method thereof capable of minimizing a total thickness after mounting a component by having a cavity part in which the component is inserted in a part of an existing printed circuit board without using an extra special material. The printed circuit board of the present invention includes: an internal layer which is formed with a flexible circuit board; an external insulating layer which is formed to be stacked on one or the other side of the internal layer; an external circuit layer which is formed to be stacked on one side of the external insulating layer; an external plating layer which is formed to be stacked on one side of the external circuit layer; and an external coating layer which is formed to be stacked on one side of the external insulating layer and the external plating layer. The cavity part which is a space in which a component is inserted and mounted is formed in the external insulating layer, the external circuit layer, the external plating layer, and the external coating layer which are arranged between either one side or the other side of the internal layer. |
