发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SUPPORTING LAYER OVER SEMICONDUCTOR DIE IN THIN FAN-OUTWAFER LEVEL CHIP SCALE PACKAGE |
摘要 |
A semiconductor device includes a semiconductor die. An encapsulant is formed around the semiconductor die. A build-up interconnect structure is formed over a first surface of the semiconductor die and encapsulant. A first supporting layer is formed over a second surface of the semiconductor die as a supporting substrate or silicon wafer disposed opposite the build-up interconnect structure. A second supporting layer is formed over the first supporting layer an includes a fiber enhanced polymer composite material comprising a footprint including an area greater than or equal to an area of a footprint of the semiconductor die. The semiconductor die comprises a thickness less than 450 micrometers (μm). The thickness of the semiconductor die is at least 1 μm less than a difference between a total thickness of the semiconductor device and a thickness of the build-up interconnect structure and the second supporting layer. |
申请公布号 |
SG2013059852(A) |
申请公布日期 |
2014.04.28 |
申请号 |
SG20130059852 |
申请日期 |
2013.08.06 |
申请人 |
STATS CHIPPAC LTD |
发明人 |
LIN, YAOJIAN;CHEN, KANG;GU, YU |
分类号 |
|
主分类号 |
|
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|