RESIN COMPOSITION FOR ADHESIVE, ADHESIVE COMPOSITION COMPRISING THE RESIN COMPOSITION AND ADHESIVE SHEET USING THE SAME FOR ATTACHING REINFORCING PLATE ON FPCB

摘要

The present invention relates to an adhesive composition which comprises acryl rubber, epoxy hardeners, phenol hardeners and thermoplastic resin as solid components, has excellent adhesion on a reinforcement plate while maintaining long-term storage stability, exhibits heat resistance corresponding to lead-free solder reflow processing temperature and has high processability since initial adhesion is improved, and an adhesive sheet for attaching a reinforcement plate of a flexible printed circuit board using the same. The adhesive composition is characterized by comprising 30-150 parts by weight of the epoxy hardener, 5-50 parts by weight of the phenol hardener and 15-45 parts by weight of the thermoplastic resin based on 100 parts by weight of the acryl rubber, wherein the acryl rubber contains a copolymer of acrylonitrile, acrylic acid, and alkyl acrylate and has an acid value in the range of 5-50 mg KOH/g.