<p>A method of forming a metal pattern comprises forming a metal ink layer on a substrate; heating the substrate on which the metal ink layer is formed; forming a protective layer on the metal ink layer; patterning the metal ink layer by allowing a laser irradiated at the upper portion of the substrate to pass through the protective layer; and leaving a metal pattern by removing the protective and metal ink layers. The method of forming a metal pattern layer is provided to prevent a metal ink layer from coming in direct contact with oxygen in the air, moisture and external light by performing a laser patterning process after forming the protective layer on the metal ink layer, thereby improving uniformity when a metal pattern is formed through laser patterning. [Reference numerals] (AA) Start; (BB) End; (S10) Step of forming a metal ink layer on a substrate; (S20) Step of heating the substrate on which the metal ink layer is formed; (S30) Step of forming a protective layer on the metal ink layer; (S40) Step of patterning the metal ink layer by irradiating the substrate with a laser; (S50) Step of leaving a metal pattern by removing the protective and metal ink layers; (S60) Step of drying the metal pattern</p>
申请公布号
KR20140047763(A)
申请公布日期
2014.04.23
申请号
KR20120113607
申请日期
2012.10.12
申请人
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
发明人
YANG, MIN YANG;YOUN, JIN HO;KANG, BONG CHUL;PARK, JUNG HWAN;SON, SEOK WOO